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The subproject TOOLS includes the development of a Step and Stamp Nanopatterning Tool for Hot Embossing and UV-Nanoimprint Lithography with an overlay accuracy of 250nm (WP15), a Stencil Mask Alignment and Fixation Tool for alignment accuracy of 1µm at the first and 250nm at the final stage (WP16) and an alignment system with an overlay accuracy of less than 20nm at wafer scale (WP17)
NPS300: Nano Patterning Stepper (SUSS MicroTec)
Aligned Hot & Cold Embossing Step & Repeat mode Imprinting of sub-20 nm resolution
KEY DESIGN FEATURES
Sub-20 nm embossing capability Overlay Accuracy: 250 nm Stamp size: 50/65mm (100m) Wafer Size: up to 300mm Pre-leveling accuracy 20 µradian Self leveling by flexure stage
The mode of operation is illustrated below for both UV–NIL and Hot embossing sequence. The alignment can be performed before each imprinting step to provide the highest alignment accuracy

Hot Embossing Sequence
UV - NIL Sequence
Stencil Mask Alignment and Fixation Tool (SUSS MicroTec)
The alignment can be done for the backside or from the topside with an alignment accuracy down to 250nm
The adapter frame for the stencil tooling is prepared for 8-inch fixtures. To achieve a high alignment accuracy the movement after the alignment is minimimzed; the alignment gap was reduced down to 20µm. Self leveling is performed by flexure stage
 
Overlay Accuracy in NIL (Obducat)
The method relies on evanescent wa- ve coupling. It e- nables subwave- lenght precision - purely limited by nanoscaled alignment pattern
+ No need for a transparent substrate or stamp
+ No need for a special stamp or substrate
+ Accuracy based on nanoscale alignment marks
+ Smart pattern allow < 10 nm overlay resolution
+ Active alignment possible during imprint
+ Two stage alignment: <1µm ex-situ, <10nm in-situ